Protection apparatus for a photonic device

A method of fabricating an electronic device, the method comprising:

• connecting a photonic die to a substrate;
• temporarily attaching a removable protection apparatus to the substrate;
• attaching a photonic connector to the photonic die;
• disposing at least a portion of the photonic connector inside a housing of the protection apparatus, wherein disposing at least the portion of the photonic connector comprises disposing at least the portion of the photonic connector in a first housing portion coupled to a second housing portion;
• performing a fabrication process with the photonic connector disposed at least partially inside the housing while the photonic connector is attached to the photonic die;
• and
• removing the photonic connector from the housing after completion of the fabrication process.