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US 12,717,080 B2Granted
Signal communication through optical-engine based interconnect component
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHsing-Kuo Hsia, Chen-Hua Yu, Chih-Wei Tseng, Jui Lin Chao
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Abstract
A method includes encapsulating a first device die and a second device die in an encapsulant, and forming an interconnect structure over and electrically connecting to the first device die and the second device die. A waveguide is formed in the interconnect structure. An optical-engine based interconnect component is bonded to the interconnect structure. The optical-engine based interconnect component forms a part of a signal path that connects the first device die to the second device die.
Claims20
A method comprising:
- encapsulating a first device die and a second device die in a first encapsulant;
- forming a first interconnect structure over and electrically connecting to the first device die and the second device die;
- forming a first waveguide in the first interconnect structure;
- and
- bonding an optical-engine based interconnect component to the first interconnect structure, wherein the optical-engine based interconnect component comprises:
- an electronic die;
- and
- a photonic die bonded to the electronic die, wherein the photonic die comprises a plurality of waveguides, and wherein the electronic die and the photonic die collectively form a part of a signal path that connects the first device die to the second device die.
5 more elements
A package comprising:
- a first device die;
- a second device die;
- and
- at least one optical-engine based interconnect component comprising a photonic die therein, wherein the at least one optical-engine based interconnect component is signally coupled between the first device die and the second device die, and wherein the at least one optical-engine based interconnect component is configured to:
- receive an electrical signal from the first device die;
- convert the electrical signal to an optical signal;
- transferring the optical signal through a waveguide, wherein in a top view of the package, the waveguide has a cross shape including a first portion and a second portion in first directions that are opposite to each other, and a third portion and a fourth portion in second directions that are opposite to each other and perpendicular to the first directions;
- and
- convert the optical signal received from the first portion of the waveguide back to the electrical signal and send the electrical signal to the second device die.
6 more elements
A package comprising:
- a first device die;
- a second device die;
- an interconnect structure over the first device die and the second device die, wherein the interconnect structure comprises:
- a plurality of dielectric layers;
- a plurality of redistribution lines in the plurality of dielectric layers;
- and
- a first waveguide in the plurality of dielectric layers;
- and
- an optical-engine based interconnect component over and bonded to the interconnect structure, the optical-engine based interconnect component comprising:
- a photonic die comprising a second waveguide, wherein the first waveguide is optically coupled to the second waveguide;
- an electronic die bonded to the photonic die through bond pads;
- and
- a transparent gap-fill material encapsulating the electronic die therein, wherein a first sidewall of the photonic die is vertically aligned to a second sidewall of the electronic die, and a third sidewall of the photonic die is vertically aligned to a fourth sidewall of the transparent gap-fill material.
10 more elements
Dependencies are inferred from the claim text.