Device for drying semiconductor substrates
AssigneeSiltronic AG
InventorsSebastian Geissler, Simon Rothenaicher
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Abstract
A device is for drying disc-shaped substrates. The device has an elongated body having a top surface, a bottom surface, and a circumferential surface. The elongated body has a hole in the top surface forming a channel, which extends to a lower drainage part of the elongated body, and is chamfered having a chamfer depth and a chamfer angle forming an edge between the chamfer and the top surface and forming a conical recess suitable for resting a disc shaped substrate. The chamfer angle is more than 10° and less than 30°. The chamfer depth is more than 6 mm and less than 12 mm.
Claims8
A device for drying disc-shaped substrates, the device comprising:
- an elongated body having a top surface, a bottom surface, and a circumferential surface, the elongated body comprising a hole in the top surface forming a channel, which extends to a lower drainage part of the elongated body, and is chamfered having a chamfer depth and a chamfer angle forming an edge between the chamfer and the top surface and forming a conical recess configured to rest a disc shaped substrate,
- wherein the chamfer angle is more than 100 and less than 30°, and
- wherein the chamfer depth (L1) is more than 6 mm and less than 12 mm.
Dependencies are inferred from the claim text.