Roof repair apparatus and method

A method for repairing a compromised shingle having a void, a portion of the compromised shingle and the void being covered by an overlapping shingle, the method comprising:

• disconnecting a portion of the overlapping shingle from the compromised shingle by separating a length of a bond connecting the compromised shingle to the overlapping shingle that includes a projected position of the void;
• covering the void with a patch by inserting at least a portion of the patch through the length of the bond connecting the compromised shingle to the overlapping shingle that was separated, the patch including:
• a substantially rigid substrate having a top surface and a bottom surface;
• and
• a sealant disposed on at least a portion of the top surface and at least a portion of the bottom surface;
• and
• applying a compressive force to the substantially rigid substrate to urge the sealant disposed on the bottom surface of the substantially rigid substrate at least partially into the void to seal the void;
• wherein the substantially rigid substrate extends along at least a portion of the void and supported the sealant disposed on the bottom surface during application of the compressive force such that the sealant remains adhered and does not detach into the void.

A method for repairing a shingle having a hole that is covered by an overlapping shingle, the method comprising:

• separating a portion of an adhesive bond between the shingle and the overlapping shingle, the separated portion being located directly above the hole;
• lifting the overlapping shingle along the separated portion of the adhesive bond;
• inserting a patch between the shingle and the overlapping shingle through the separated portion of the adhesive bond, the patch including:
• a substantially rigid, generally planar substrate having a top surface, a bottom surface, a front edge, and a rear edge, the substrate sized such that the substrate extends across at least a portion of the hole;
• a sealant disposed on a majority of the bottom surface of the substrate while a strip adjacent the front edge of the bottom surface is substantially free of the sealant;
• and
• a strip of the sealant disposed on the top surface adjacent the front edge while a portion of the top surface is substantially free of the sealant;
• sliding the substrate between the shingle and the overlapping shingle such that the front edge and the portions substantially free of sealant contact the shingles during insertion;
• positioning the substrate so that the substrate lays across the hole;
• and
• applying a generally downward force to the overlapping shingle over the substrate so that:
• (i) at least some of the sealant on the bottom surface at least partially enters the hole while remaining adhered to and supported by the rigid substrate, (ii) at least some of the sealant on the bottom surface bonds the substrate to the shingle, (iii) at least some of the sealant on the top surface bonds the substrate to the overlapping shingle, and (iv) the rigid substrate supports at least some of the sealant over the hole such that the supported sealant does not detach from the substrate into the hole.