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AssigneeSeiko Epson Corporation
InventorsKaname Nagatani, Hirokazu Sekino, Tomoki Abe
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There is provided a support material removal device for removing a support material from a three-dimensional molded object in an ejection target by ejecting liquid at the ejection target, which was molded by a three-dimensional molding machine, includes a nozzle for ejecting the liquid, an arm for gripping the nozzle, a trajectory calculating section for calculating a trajectory for driving the arm based on first shape information indicating the shape of the ejection target in a state where the support material is attached to it and second shape information indicating the shape of the three-dimensional molded object corresponding to the state where the support material is removed from the ejection target, and a drive section for driving the arm based on the trajectory calculated by the trajectory calculating section.
A support material removal device that removes a support material from a three-dimensional molded object molded by a three-dimensional molding machine, the support material removal device comprising:
A support material removal method of using a support material removal device, which includes a nozzle for ejecting liquid in a continuous flow, and changing the continuous flow to droplets so that the liquid collides with an ejection target in the form of the droplets and an arm for gripping the nozzle, to eject the liquid against the ejection target, which was molded by a three-dimensional molding machine that shaped a three-dimensional molded object while the three-dimensional molded object was supported by a support material, in order to, with respect to the ejection target, remove the support material from the three-dimensional molded object, the support material removal method comprising:
Dependencies are inferred from the claim text.