Laser-processing apparatus with debris removal system and integrated beam dump and methods of operating the same

A system, comprising:

• a debris removal system having a vacuum nozzle configured to allow a beam of laser energy generated by a laser source and propagating along a beam path to pass therethrough, wherein:
• the debris removal system is positioned between the laser source and a workpiece, and
• the debris removal system is configured to capture debris created by processing of the workpiece by the laser source;
• a vacuum source in communication with the vacuum nozzle via an exhaust passage, the vacuum source configured to remove at least a portion of the debris created by processing of the workpiece by the laser source;
• an exhaust assist system operative to direct a fluid from an inlet a port across the vacuum nozzle into the exhaust passage, thereby forcing at least a portion of the debris into the exhaust passage;
• a beam dump system coupled to the debris removal system and including an absorber having an absorber surface formed thereon, the absorber surface configured to absorb at least a portion of the beam of laser energy;
• and
• an actuator assembly operative to move the absorber relative to the debris removal system and the workpiece.

A laser processing apparatus, comprising:

• a laser source operative to generate a beam of laser energy, wherein the beam of laser energy is propagatable along a beam path to a workpiece;
• a debris removal system having a vacuum nozzle configured to allow the beam of laser energy to pass therethrough, wherein the debris removal system is positioned between the laser source and the workpiece;
• a vacuum source in communication with the vacuum nozzle via an exhaust passage, the vacuum source configured to remove at least a portion of debris created by processing of a workpiece;
• a beam dump system coupled to the debris removal system and including an absorber having an absorber surface formed thereon, the absorber surface configured to absorb at least a portion of the beam of laser energy,
• wherein the absorber is configured to be selectively positioned within the beam path by being moved relative to the workpiece.