Methods and apparatuses for manipulating temperature

A device for manipulating a temperature of a surface, comprising:

• at least one thermoelectric material constructed and arranged to be disposed adjacent the surface;
• a power source configured to provide energy to the at least one thermoelectric material;
• a controller in electrical communication with the at least one thermoelectric material and the power source, the controller configured to cause the at least one thermoelectric material to generate a plurality of thermal pulses in succession at a region of the at least one thermoelectric material constructed and arranged to be disposed adjacent the surface such that an average power consumption of the power source during the plurality of thermal pulses is less than 1 Watt, wherein each of the plurality of thermal pulses is configured to adjust a temperature at the region of the at least one thermoelectric material adjacent the surface from a first temperature to a second temperature at a first average rate between about 0.1° C./sec and about 10.0° C./sec, wherein the controller is configured to operate the at least one thermoelectric material to maintain a temperature of the surface within 10 degrees Celsius of an initial temperature of the surface during operation;
• and
• a housing, wherein at least a portion of the housing is constructed of a thermally conductive material in thermal contact with the at least one thermoelectric material, wherein the portion of the housing constructed of the thermally conductive material forms at least a portion of an enclosure at least partially surrounding the controller and a power source on multiple sides, wherein the portion of the housing constructed of the thermally conductive material and at least partially surrounding the controller and the power source on multiple sides is a heat dissipation unit, and wherein the thermally conductive material has an exterior surface profile substantially free of protrusions extending greater than 1 mm away from the surface between a first end region of the device and a second end region of the device, the second end region located opposite the first end region.

A method for manipulating a temperature of a surface using a device, comprising:

• positioning a region of at least one thermoelectric material adjacent to the surface;
• generating a plurality of cooling thermal pulses in succession at the region of the at least one thermoelectric material adjacent the surface such that an average power consumption of a power source providing energy to the at least one thermoelectric material during the plurality of cooling thermal pulses is less than 2 Watts, wherein the thermal pulses maintain a temperature of the surface within 10 degrees Celsius of an initial temperature of the surface during operation;
• transferring heat between the at least one thermoelectric material and at least a portion of a housing that is constructed of a thermally conductive material in thermal contact with the at least one thermoelectric material, wherein the portion of the housing constructed of the thermally conductive material forms at least a portion of an enclosure at least partially surrounding a controller and a power source on multiple sides, wherein the portion of the housing constructed of the thermally conductive material and at least partially surrounding the controller and the power source on multiple sides is a heat dissipation unit;
• and
• changing a temperature of the thermally conductive material by greater than 10 degrees Celsius per Watt of power applied to the thermally conductive material at standard ambient temperature and pressure (SATP) conditions.