Semiconductor package and method for forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChuei-Tang Wang, Tso-Jung Chang, Jeng-Shien Hsieh, Chih-Peng Lin, Chieh-Yen Chen, Chen-Hua Yu
Life of this patent
Estimating the term…
Abstract
A method for forming a semiconductor package is provided. The method includes forming a first photonic routing structure over a substrate, disposing the first photonic routing structure over a redistribution structure, disposing a second photonic routing structure and an optical engine die on the redistribution structure and forming a molding structure between and separating the first photonic routing structure and the second photonic routing structure.
Claims20
A method for forming a semiconductor package, comprising:
- forming a first photonic routing structure over a substrate, comprising:
- forming a curved surface over the substrate;
- forming an oxide layer over the curved surface;
- recessing the oxide layer to expose the curved surface;
- and
- forming a reflective element over the curved surface;
- disposing the first photonic routing structure over a redistribution structure, wherein the first photonic routing structure comprises a first waveguide;
- disposing a second photonic routing structure and an optical engine die on the redistribution structure, wherein the second photonic routing structure comprises a second waveguide optically coupled to the first waveguide;
- and
- forming a molding structure between the first photonic routing structure and the second photonic routing structure.
A method for forming a semiconductor package, comprising:
- forming a redistribution structure on a substrate;
- disposing a first photonic routing structure on the redistribution structure, comprising:
- forming a recess having a curved surface in an optical interposer die;
- forming a first dielectric structure covering the curved surface, wherein a first waveguide is embedded in the first dielectric structure;
- and
- forming a reflective element over the first dielectric structure;
- disposing a second photonic routing structure and an optical engine die on the redistribution structure, wherein the second photonic routing structure comprises a second dielectric structure and a second waveguide disposed in the second dielectric structure, the optical engine die is disposed on the second photonic routing structure, and the second waveguide is optically coupled to the first waveguide and the optical engine die.
A semiconductor package, comprising:
- a first substrate;
- a redistribution structure formed on the first substrate;
- a first photonic routing structure disposed on the redistribution structure, comprising:
- a second substrate having curved surface;
- a first dielectric structure disposed over the second substrate, wherein the curved surface faces the first dielectric structure;
- a first waveguide disposed in the first dielectric structure;
- and
- a reflective element disposed in the first dielectric structure and overlapping the curved surface;
- an optical interposer die disposed on the first photonic routing structure;
- a second photonic routing structure disposed on the redistribution structure, wherein the second photonic routing structure comprises a second dielectric structure and a second waveguide disposed in the second dielectric structure and optically coupled to the first waveguide;
- an optical engine die disposed on the second photonic routing structure;
- and
- a molding structure disposed between the first photonic routing structure and the second photonic routing structure.
Dependencies are inferred from the claim text.