Semiconductor packages including interface members for welding
AssigneeTexas Instruments Incorporated
InventorsTobias Bernhard Fritz, Marcus Rudolf Zimnik
Life of this patent
Estimating the term…
Abstract
An example semiconductor package includes a semiconductor die. In addition, the semiconductor package includes a mold compound having a first side, a second side opposite the first side, and an axis extending between the first side and the second side, the mold compound covering the semiconductor die. Further, the semiconductor package includes an interface member including a first portion and a second portion, the first portion is coupled to the second portion. The first portion is positioned along the first side, the second portion is positioned along the second side, and an engagement of a welding horn with the first portion is adapted to weld the second portion to a surface.
Claims23
A semiconductor device, comprising:
- a semiconductor die;
- a mold compound having a first side and a second side opposite the first side, the mold compound covering the semiconductor die;
- and
- an interface member including a first portion and a second portion, the first portion is coupled to the second portion, the first portion is on the first side, the second portion is on the second side, the semiconductor die is on the second portion, and the second portion including a metallic material and having a surface facing away from the semiconductor die, and the surface is configured to melt responsive to a vibration.
A semiconductor device, comprising:
- a semiconductor die including a force sensor;
- a mold compound having a first side and a second side opposite the first side, the mold compound covering the semiconductor die;
- a first mounting pad on the first side and external to the molding compound, the first mounting pad having a first surface facing away from the semiconductor die and configured to melt responsive to a vibration;
- and
- a second mounting pad on the second side and external to the molding compound, the second mounting pad having a second surface facing away from the semiconductor die and configured to melt responsive to a vibration.
A semiconductor device, comprising:
- a semiconductor die including a force sensor;
- a die pad having opposite first and second surfaces, the semiconductor die mounted on the first surface;
- and
- an interface member, at least a portion of the interface member is on the second surface, and the portion has a surface facing away from the die pad, and the surface is configured to melt responsive to a vibration.
Dependencies are inferred from the claim text.