Cold plate cooling for wafer-scale integration with back side modular power delivery

An apparatus for cooling comprising:

• a wafer-scale silicon interposer (WSSI), wherein a front side of the WSSI is bonded to a plurality of functional chips, wherein the plurality of functional chips creates heat during operation, and wherein the WSSI includes a plurality of through-silicon vias (TSVs), wherein a back side of the WSSI is coupled to a plurality of DC-to-DC power converters;
• a cold plate, wherein the cold plate comprises an inlet plate, a jet-plate, and a fin-plate;
• at least one inlet nozzle located on the inlet plate, wherein the inlet nozzle receives a coolant at a first temperature, and wherein the jet-plate is used to spray the coolant that was received on the fin-plate, and wherein at least a portion of the heat that was created is transferred, by the cold plate, to the coolant that was sent;
• and
• one or more outlet chambers within the jet-plate, wherein the one or more outlet chambers capture the coolant at a second temperature.

A system for cooling comprising:

• a wafer-scale silicon interposer (WSSI), wherein a front side of the WSSI is bonded to a plurality of functional chips, wherein the plurality of functional chips create heat during operation, wherein the WSSI includes a plurality of through-silicon vias (TSVs), and wherein a back side of the WSSI is coupled to a plurality of DC-to-DC power converters;
• a cold plate, wherein the cold plate comprises an inlet plate, a jet-plate, and a fin-plate, wherein the inlet plate includes at least one inlet nozzle, wherein the jet-plate includes one or more outlet chambers, wherein the system, when supplied with a coolant at a first temperature, is configured to:
• send the coolant at a first temperature into the at least one inlet nozzle located on the inlet plate;
• spray the coolant, by the jet-plate, on the fin-plate;
• transfer at least a portion of the heat that was created, by the cold plate, to the coolant that was sent;
• and
• capture the coolant, at a second temperature, from the one or more outlet chambers within the jet-plate.