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US 12,713,871 B2Granted
Systems and methods for semiconductor wafer transport
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsWen-Hao Cheng, Hsuan-Chih Chu, Yen-Yu Chen
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Abstract
A device includes a movable blade having a first surface to receive a semiconductor wafer. The device can include a positional sensor to detect a position of the semiconductor wafer on a surface of the movable blade, relative to a stationary body. The movable blade can be configured to move relative to the stationary body to cause a displacement of the semiconductor wafer relative to the movable blade. The positional sensor can be coupled to the movable blade.
Claims14
A device, comprising:
- a movable blade configured to receive a semiconductor wafer;
- a positional sensor configured to detect a position of the semiconductor wafer on a surface of the movable blade, relative to a stationary body;
- and
- a plurality of temperature sensors to determine a temperature of a plurality of zones of the semiconductor wafer, the plurality of zones being concentrically spaced from one another;
- wherein the movable blade is further configured to move with respect to the stationary body to cause a displacement of the semiconductor wafer relative to the movable blade;
- and
- wherein the positional sensor is physically coupled to the movable blade.
4 more elements
An assembly, comprising:
- a movable blade;
- a vacuum interface to adhere a semiconductor wafer to the movable blade;
- a positional sensor configured to detect a lateral position of the semiconductor wafer relative to a surface of the movable blade;
- and
- a plurality of temperature sensors to determine temperatures of a plurality of zones of the semiconductor wafer.
2 more elements
Dependencies are inferred from the claim text.