Display device comprising semiconductor light emitting device in opening hole of planarization layer

A display device comprising a semiconductor light emitting device, the display device comprising:

• a substrate;
• first assembly wiring and second assembly wiring alternately arranged on the substrate and spaced apart from each other;
• a planarization layer disposed on the first assembly wiring and the second assembly wiring, and having an opening hole and a contact hole;
• a light emitting device disposed within the opening hole of the planarization layer, and having a first electrode overlapping the first assembly wiring and the second assembly wiring;
• and
• a first light absorbing layer disposed to surround an area where the light emitting device is disposed and having light absorbing characteristics,
• wherein the first assembly wiring vertically overlaps the second assembly wiring, and
• wherein the second assembly wiring includes an electrode hole in a region that vertically overlaps the first assembly wiring.

A display device comprising a semiconductor light emitting device, the display device comprising:

• assembly wiring arranged on a substrate;
• a light emitting device disposed on the assembly wiring;
• a planarization layer disposed on the assembly wiring and disposed to surround the light emitting device;
• a light absorption layer disposed to surround the light emitting device and having light absorbing characteristics,
• wherein the light absorption layer is disposed between the assembly wiring and the planarization layer, and
• wherein the planarization layer comprises:
• a first planarization layer disposed to surround side and top surfaces of the light absorption layer, and
• a second planarization layer disposed to surround side and top surfaces of the first planarization layer;
• and
• a first opening hole, which is an area formed by overlapping opening areas of each of the light absorption layer and the first planarization layer to overlap the assembly wiring,
• wherein the light emitting device is disposed in the first opening hole.