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US 12,713,630 B2Granted
Wafer level packaging process for thin film inductors
AssigneeQUALCOMM Incorporated
InventorsAnshih Tseng, Peng Zou, Joseph Dibene, Gerard Williams
Life of this patent
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Abstract
An integrated circuit (IC) package, including an integrated circuit (IC) die including an input/output (I/O) pad, and a vertical thin-film inductor (TFI) extending vertically substantially from the I/O pad to a solder bump.
Claims26
An integrated circuit (IC) package, comprising:
- an integrated circuit (IC) die including an input/output (I/O) pad;
- and
- a vertical thin-film inductor (TFI) extending vertically substantially from the I/O pad to a solder bump,
- wherein the vertical TFI comprises an electrical conducting pillar extending vertically substantially from the I/O pad to a solder bump, and
- wherein the vertical TFI further comprises a first magnetic semi-ring layer electrically isolated from the electrical conducting pillar, wherein the electrical conducting pillar extends coaxially through the first magnetic semi-ring layer.
2 more elements
A method of fabricating an integrated circuit (IC) package, comprising:
- providing an integrated circuit (IC) including an input/output (I/O) pad;
- forming a vertical thin-film inductor (TFI) extending vertically from substantially the I/O pad, wherein forming the vertical TFI comprises forming an electrical conducting pillar extending vertically from substantially the I/O pad to the solder bump;
- forming a solder bump over the vertical TFI;
- and
- forming a first magnetic semi-ring layer coaxially surrounding and electrically isolated from the electrical conducting pillar.
2 more elements
Dependencies are inferred from the claim text.