Radio-frequency module and communication device

A radio-frequency module, comprising:

• a first module substrate including a first major surface and a second major surface that are opposite to each other;
• a second module substrate including a third major surface and a fourth major surface that are opposite to each other, the third major surface being disposed facing the second major surface;
• a plurality of electronic components disposed between the second major surface and the third major surface, on the first major surface, and on the fourth major surface;
• and
• a plurality of external connection terminals disposed on the fourth major surface, wherein
• the plurality of electronic components include a power amplifier,
• the power amplifier includes
• a fifth major surface and a sixth major surface that are opposite to each other and
• a circuit section that is formed at a position closer to the fifth major surface than the sixth major surface, and includes an amplification transistor,
• the power amplifier has the fifth major surface disposed facing the second major surface or the fourth major surface, and
• a heat dissipation conductor extending along a direction from the third major surface to the fourth major surface is joined to the sixth major surface.