Planar transformers with interleaved windings and high voltage isolation

A power converter module, comprising:

• one or more ports fed by a source;
• one or more quadruple active bridge converters comprising switching devices coupled with the one or more ports, wherein each quadruple active bridge converter of the one or more quadruple active bridge converters is coupled to a planar transformer assembly configured to generate an isolated direct current (DC) output based on the source, and wherein the planar transformer assembly comprises:
• planar transformer windings configured to at least generate an isolated output, wherein the planar transformer windings comprise one or more primary windings interleaved with one or more secondary windings embedded on layers of a printed circuit board;
• one or more vias within the layers of the printed circuit board, wherein the one or more vias provide at least a connection path to the planar transformer windings;
• a magnetic core around the planar transformer windings;
• a field-shaping layer configured to at least shape an electric field of the isolated DC output generated by the planar transformer windings and the magnetic core, wherein the field-shaping layer is disposed above a soldermask layer on a top surface of the printed circuit board, wherein the field-shaping layer is on a separate vertical plane from the planar transformer windings, and wherein the field-shaping layer is placed on a top layer of the printed circuit board beyond an outer boundary of the magnetic core and the planar transformer windings;
• and
• a high-voltage dielectric material between each layer of the printed circuit board.

A method of manufacturing a planar transformer, comprising:

• interleaving a primary winding with one or more secondary windings;
• embedding the primary winding and the one or more secondary windings into different layers of a printed circuit board;
• coupling the primary winding with vias and the one or more secondary windings with the vias to provide an alternate connection path to the primary winding and the one or more secondary windings within the different layers of the printed circuit board;
• coupling the primary winding to a current source wherein the primary winding is coupled to the current source by one or more switching devices;
• coupling the one or more secondary windings to one or more current ports wherein the one or more secondary windings are coupled to the one or more current ports by one or more other switching devices;
• separating the primary winding and the one or more secondary windings with at least a high voltage dielectric capable of maintaining isolation between each layer of windings;
• surrounding the primary winding and the one or more secondary windings with a magnetic core;
• and
• integrating a field-shaping layer is disposed above a soldermask layer on a top surface of the printed circuit board, wherein the field-shaping layer is on a separate vertical plane from the primary windings and the one or more secondary windings, and wherein the field-shaping layer is placed on a top layer of the printed circuit board beyond an outer boundary of the magnetic core, the primary windings, and the one or more secondary windings, wherein the field-shaping layer is configured to shape an electric field of an output generated by the primary winding and the one or more secondary windings.