Heat assisted magnetic recording head with slider and laser diode
AssigneeHeadway Technologies, Inc.
InventorsKoji Shimazawa, Dayu Zhou, Weihao Xu
Life of this patent
Estimating the term…
Abstract
The present embodiments relate to a heat-assisted magnetic recording (HAMR) head with a cavity configured to receive a laser diode (LD) chip. The inlet coupler layer can extend beyond a dielectric layer such that the dielectric layer is recessed away from a cavity receiving the LD chip, and a distance (G) between the inlet coupler and the LD chip is more easily controlled and modified to improve performance of the head. The dielectric layer can be angled at a first angle, and the inlet coupler, a waveguide, and an overcoat layer can be angled at a second angle and forming a side of the cavity.
Claims20
A heat-assisted magnetic recording (HAMR) head with a cavity configured to receive a laser diode (LD) chip, the HAMR head comprising:
- a first dielectric layer;
- a second dielectric layer disposed over a portion of the first dielectric layer, the second dielectric layer comprising a first side and a second side forming a first angle relative to the first dielectric layer;
- an inlet coupler layer disposed over the second dielectric layer, wherein the inlet coupler layer comprises a first side and a second side, the second side forming a second angle relative to the first dielectric layer, and wherein the second side of the inlet coupler layer extends beyond the second side of the second dielectric layer by a length (L);
- a waveguide disposed over the inlet coupler layer;
- and
- an overcoat layer, with a first portion of the overcoat layer disposed over the waveguide, wherein the cavity configured to receive the LD chip is formed at a first side by the first portion of the overcoat layer, the waveguide, the inlet coupler layer, and the second dielectric layer, and at a second side by a second portion of the overcoat layer.
A method for manufacturing a heat-assisted magnetic recording (HAMR) head with a cavity configured to receive a laser diode (LD) chip, the method comprising:
- providing a first dielectric layer;
- disposing a second dielectric layer over a portion of the first dielectric layer;
- disposing an inlet coupler layer over the second dielectric layer, wherein the inlet coupler layer comprises a first side and a second side;
- disposing a waveguide over the inlet coupler layer;
- disposing an overcoat layer over the waveguide;
- and
- etching a portion of the second dielectric layer, inlet coupler layer, waveguide, and overcoat layer to form a cavity, the second dielectric layer comprising a first side and a second side forming a first angle relative to the first dielectric layer, the second side forming a second angle relative to the first dielectric layer, and wherein the second side of the inlet coupler layer extends beyond the second side of the second dielectric layer by a length (L), a first portion of the overcoat layer disposed over the waveguide, and wherein the cavity is formed at a first side by the first portion of the overcoat layer, the waveguide, the inlet coupler layer, and the second dielectric layer, and at a second side by a second portion of the overcoat layer.
A head gimbal assembly comprising:
- a recording head including a slider and a device connected to the slider, the device including:
- a first dielectric layer;
- a second dielectric layer disposed over a portion of the first dielectric layer;
- an inlet coupler layer disposed over the second dielectric layer, wherein the second dielectric layer is recessed relative to the inlet coupler layer;
- a waveguide disposed over the inlet coupler layer;
- and
- an overcoat layer, with a first portion of the overcoat layer disposed over the waveguide, wherein a cavity is formed in the device by any of first dielectric layer, the second dielectric layer, the inlet coupler layer, the waveguide, and the overcoat layer;
- a load beam connected to the recording head;
- and
- a suspension connected to the load beam and configured to support the recording head.
Dependencies are inferred from the claim text.