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US 12,710,789 B2Granted
Add-on assembly, identification method for add-on assembly, and wearable device
AssigneeBeijing Xiaomi Mobile Software Co., Ltd.
InventorsXuefeng Wang, Lei Meng
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Abstract
An add-on assembly includes multiple different sub-assemblies, each of the sub-assemblies is provided with a magnetic absorption part, the magnetic absorption part of each of the sub-assemblies is used for adsorbed-connection with a device main body of a wearable device, the magnetic absorption parts of any two of the sub-assemblies are different, and each of the sub-assemblies is identified by the device main body through the magnetic absorption part.
Claims18
An add-on assembly, comprising:
- multiple different sub-assemblies, wherein each of the sub-assemblies comprises a magnetic adsorption part, the magnetic adsorption part of each of the sub-assemblies is used for adsorbed-connection with a device main body of a wearable device, the magnetic adsorption parts of any two of the sub-assemblies are different, and each of the sub-assemblies is identified by the device main body through the magnetic adsorption part,
- wherein the multiple different sub-assemblies are configured to realize additional functions other than main functions of the device main body.
A wearable device, comprising:
- a device main body comprising a magnetic field sensor, a processor, and a magnetic adsorption fitting part;
- and
- an add-on assembly, comprising multiple different sub-assemblies, wherein each of the sub-assemblies comprises a magnetic adsorption part, the magnetic adsorption part of each of the sub-assemblies is used for adsorbed-connection with a device main body of a wearable device, the magnetic adsorption parts of any two of the sub-assemblies are different, and each of the sub-assemblies is identified by the device main body through the magnetic adsorption part,
- wherein the magnetic adsorption fitting part is configured to be in the absorbed-connection with the magnetic adsorption part of one of the sub-assemblies, the magnetic field sensor is used for acquiring a magnetic field signal when the magnetic adsorption part and the magnetic adsorption fitting part are in an adsorbed state, and outputting the magnetic field signal to the processor, and the processor is configured to identify the one of the sub-assemblies according to the magnetic field signal,
- wherein the multiple different sub-assemblies are configured to realize additional functions other than main functions of the device main body.
2 more elements
Dependencies are inferred from the claim text.