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US 12,710,703 B2Granted
Lithography system and method including thermal management
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorChia-Wei Wang
Life of this patent
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Abstract
The present disclosure provides a method for lithography system that includes one or more thermal sensors that provide feedback to a thermal management controller. The thermal management controller provides instructions to a thermal regulation component such as a heat exchanger and gas jets to provide cooling of a reticle used in the lithography system.
Claims18
A method of performing lithography, wherein the method includes:
- providing a mask to a mask holder of a lithography tool;
- providing a target substrate to a wafer stage of the lithography tool;
- delivering a radiation beam from a source of the lithography tool, wherein the delivered radiation beam is reflected off of the mask;
- providing the reflected radiation beam to the target substrate;
- and
- during the delivering the radiation beam, performing a thermal control management, wherein the thermal control management includes:
- receiving a temperature associated with the mask holder from a first temperature measurement device,
- receiving a temperature associated with the mask from a second temperature measurement device,
- modifying an output of a thermal regulation component based on the received temperatures, wherein the modifying the output includes determining a gas flow.
6 more elements
A method of performing lithography, wherein the method includes:
- providing a mask and a target substrate to a lithography tool;
- delivering a radiation beam to the mask, wherein the delivered radiation beam is reflected off of the mask;
- providing the reflected radiation beam to the target substrate;
- and
- during the delivering the radiation beam, performing a thermal control management, wherein the thermal control management includes:
- receiving a temperature associated with an environment of the mask, wherein the temperature associated with the environment of the mask is received from a direct sensing component;
- receiving a temperature associated with the mask, wherein the temperature associated with the mask is received from an indirect sensing component;
- and
- modifying an output of a thermal regulation component based on both of the received temperatures, wherein the modifying the output includes determining a gas flow.
6 more elements
Dependencies are inferred from the claim text.