On-chip structure for fiber array alignment by assisting edge coupler index-matching epoxy/oil filling

A system comprising:

• a plurality of edge couplers, each comprising an undercut formed beneath a waveguide, wherein ribs suspend the waveguide over the undercut;
• one or more main buckets configured to receive an index-matching liquid;
• one or more monitor buckets;
• and
• a duct that couples together the plurality of edge couplers, the one or more main buckets, and the one or more monitor buckets, wherein;
• the duct fluidically interconnects the undercuts of the plurality of edge couplers with the one or more main buckets and the one or more monitor buckets to form a network of communicating vessels such that a hydrostatic pressure of the index-matching liquid equalizes across the plurality of edge couplers, and
• the duct forms communicating vessels between the plurality of edge couplers, the one or more main buckets, and the one or more monitor buckets, such that the index-matching liquid introduced through the one or more main buckets is directed to flow through the duct to simultaneously fill the undercuts of the plurality of edge couplers and flow to the one or more monitor buckets, thereby assisting uniform filling and monitoring of the index-matching liquid across multiple edge couplers on a wafer.