Inspecting apparatus and semiconductor manufacturing equipment including the same

Semiconductor manufacturing equipment comprising:

• a substrate treating apparatus configured to treat substrates using plasma;
• and
• an inspecting apparatus configured to determine whether an equipment part in the substrate treating apparatus is operating properly,
• wherein
• the inspecting apparatus includes:
• a measurement module configured to measure a first impedance at a first port, which is provided on one side of an equipment part in a substrate treating apparatus, and a second impedance at a second port, which is provided on the other side of the equipment part;
• a comparison module configured to compare the first and second impedances;
• and a determination module configured to determine whether the equipment part is operating properly based on a result of the comparison of the first and second impedances,
• the first impedance includes a first resistance and a first reactance,
• the second impedance includes a second resistance and a second reactance, and
• the determination module determines whether the equipment part is operating properly based on at least one of a result of the comparison of the first and second resistances and a result of the comparison of the first and second reactances.

An inspecting apparatus inspecting an equipment part in a substrate treating apparatus, based on an input impedance measurement theory, the inspecting apparatus comprising:

• a measurement module configured to measure a first impedance at a first port, which is provided on one side of the equipment part, and a second impedance at a second port, which is provided on the other side of the equipment part;
• a comparison module configured to compare the first and second impedances;
• and
• a determination module configured to determine whether the equipment part is operating properly based on a result of the comparison of the first and second impedances,
• wherein
• the first impedance includes a first resistance and a first reactance,
• the second impedance includes a second resistance and a second reactance,
• the comparison module compares the first and second resistances and compares the first and second reactances, using one of an absolute value comparison method and a difference comparison method,
• the determination module determines whether the equipment part is operating normally based on at least one of first and second conditions,
• the first condition is whether a result of the comparison of the first and second resistances is equal to or less than a first or third reference value,
• the second condition is whether a result of the comparison of the first and second reactances is equal to or less than a second or fourth reference value, and
• the determination module determines that the equipment part is operating properly if the first and second conditions are both satisfied.