System and method for wafer shape pairing for improved post-bonding performance

A wafer shape metrology system comprising:

• a wafer shape metrology sub-system configured to perform shape measurements on top wafers and bottom wafers;
• and
• a controller communicatively coupled to the wafer shape metrology sub-system, the controller including one or more processors configured to execute a set of program instructions stored in a memory, the set of program instructions configured to cause the one or more processors to:
• receive the shape measurements for a set of top wafers from the wafer shape sub-system;
• receive shape measurements for a set of bottom wafers from the wafer shape sub-system;
• sort the set of top wafers and the bottom wafers into wafer groups based on the shape measurements for the set of top wafers and the shape measurements for the set of bottom wafers;
• tag each top wafer with a wafer group number and store in memory;
• tag each bottom wafer with a wafer group number and store in memory;
• determine top wafer pairs from selected top wafer groups to establish a set of top wafer pairs;
• sort the set of top wafer pairs into top wafer pair groups;
• associate each top wafer pair group with a corresponding reference recipe, wherein each top wafer pair group is associated with a bottom wafer pair group in a pre-established manner;
• and
• direct a bonder to bond the wafer pairs in a selected wafer pair group according to a corresponding reference recipe associated with the selected wafer pair group.

A system comprising:

• a controller, the controller including one or more processors configured to execute a set of program instructions stored in a memory, the set of program instructions configured to cause the one or more processors to:
• receive shape measurements for a set of top wafers from a wafer shape sub-system;
• receive shape measurements for a set of bottom wafers from the wafer shape sub-system;
• sort the set of top wafers and the bottom wafers into wafer groups based on the shape measurements for the set of top wafers and the shape measurements for the set of bottom wafers;
• determine wafer pairs from selected wafer groups to establish a set of wafer pairs and calculate a bow difference for each wafer pair of the set of wafer pairs;
• sort the set of wafer pairs into wafer pair groups based on intervals of the bow difference;
• associate each wafer pair group with a corresponding reference recipe;
• and
• direct a bonder to bond the wafer pairs in a selected wafer pair group according to a corresponding reference recipe associated with the selected wafer pair group.

A system comprising:

• a controller, the controller including one or more processors configured to execute a set of program instructions stored in a memory, the set of program instructions configured to cause the one or more processors to:
• receive shape measurements for a set of top wafers from a wafer shape sub-system;
• receive shape measurements for a set of bottom wafers from the wafer shape sub-system;
• sort the set of top wafers and the bottom wafers into wafer groups based on the shape measurements for the set of top wafers and the shape measurements for the set of bottom wafers;
• determine top wafer pairs from selected top wafer groups to establish a set of top wafer pairs;
• sort the set of top wafer pairs into top wafer pair groups;
• associate each top wafer pair group with a corresponding reference recipe, wherein each top wafer pair group is associated with a bottom wafer pair group in a pre-established manner;
• and
• direct a bonder to bond the wafer pairs in a selected wafer pair group according to a corresponding reference recipe associated with the selected wafer pair group.

A method comprising:

• receiving shape measurements for a set of top wafers from a wafer shape sub-system;
• receiving shape measurements for a set of bottom wafers from the wafer shape sub-system;
• sorting the set of top wafers and the bottom wafers into wafer groups based on the shape measurements for the set of top wafers and the shape measurements for the set of bottom wafers;
• determining wafer pairs from selected wafer groups to establish a set of wafer pairs and calculate a bow difference for each wafer pair of the set of wafer pairs;
• sorting the set of wafer pairs into wafer pair groups based on intervals of the bow difference;
• associating each wafer pair group with a corresponding reference recipe;
• and
• directing a bonder to bond the wafer pairs in a selected wafer pair group according to a corresponding reference recipe associated with the selected wafer pair group.

A method comprising:

• receiving shape measurements for a set of top wafers from a wafer shape sub-system;
• receiving shape measurements for a set of bottom wafers from the wafer shape sub-system;
• sorting the set of top wafers and the bottom wafers into wafer groups based on the shape measurements for the set of top wafers and the shape measurements for the set of bottom wafers;
• determining top wafer pairs from selected top wafer groups to establish a set of top wafer pairs;
• sorting the set of top wafer pairs into top wafer pair groups;
• associating each top wafer pair group with a corresponding reference recipe, wherein each top wafer pair group is associated with a bottom wafer pair group in a pre-established manner;
• and
• directing a bonder to bond the wafer pairs in a selected wafer pair group according to a corresponding reference recipe associated with the selected wafer pair group.