Low-dust products using a wax emulsion
AssigneeHenry Company, LLC
InventorAmba Ayambem
Life of this patent
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Abstract
The present invention relates generally to wall repair compounds such as joint compounds, spackling compounds, and the like used to repair imperfections in walls or fill joints between adjacent wallboard panels. Particularly, the present invention relates to such a wall repair compound that comprises a dust-reduction additive that reduces the quantity of airborne dust generated when the hardened compound is sanded. The dust-reduction additive also synergistically imparts water resistance and adhesion to the wall repair compounds to which it is added. More specifically, in one embodiment, the dust-reduction additive is an emulsion comprising colloidally-protected, wax-based microstructures comprising paraffin that is chemically encapsulated by polyvinyl alcohol.
Claims23
A low-dust joint compound composition comprising:
- (i) a dust reduction additive emulsion comprising colloidally-protected wax-based (CPWB) microstructures;
- and
- (ii) a first water,
- wherein said low-dust joint compound composition has at least about 90% bond according to an ASTM C474 peel test.
Dependencies are inferred from the claim text.