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US 12,709,699 B2Granted
Polishing liquid and polishing method
AssigneeResonac Corporation
InventorsDaisuke Iikura, Masako Aoki
Life of this patent
Estimating the term…
Abstract
A polishing liquid containing: abrasive grains containing a hydroxide of a tetravalent metal element; a monovalent acid component having no carboxy group; and a non-ionic polymer, in which a pH is 4.5 or less. A polishing method including a step of polishing a surface to be polished by using this polishing liquid.
Claims17
A polishing liquid comprising:
- abrasive grains containing a hydroxide of a tetravalent metal element;
- a monovalent acid component having no carboxy group;
- and a non-ionic polymer, wherein
- a mass ratio of a content of the acid component to a content of the hydroxide of the tetravalent metal element is 0.3 or more and 5 or less,
- the non-ionic polymer contains a glycerin-based polymer and a polyoxyalkylene compound other than a glycerin-based polymer,
- a mass ratio of a content of the glycerin-based polymer to a content of the polyoxyalkylene compound other than a glycerin-based polymer is 10 or more and 100 or less, and
- a pH is 4.5 or less.
4 more elements
Dependencies are inferred from the claim text.