Thermosetting conductive resin composition and method for producing electronic component

A thermosetting conductive resin composition comprising:

• a conductive powder including a base metal;
• a resin binder comprising at least a thermosetting silicone resin having hydroxyl groups and being curable by heating without using a curing agent or a catalyst;
• and
• at least one of an amine-based additive and an acid-based additive, wherein a content of the resin binder is 3.0 parts by mass or more and 30.0 parts by mass or less relative to 100 parts by mass of the conductive powder, and the thermosetting conductive resin composition satisfies at least one of the following (1) and (2):
• (1) a content of the amine-based additive is 0.3 parts by mass or more and 20.0 parts by mass or less relative to 100 parts by mass of the thermosetting silicone resin having the hydroxyl groups and being curable by heating without using the curing agent or the catalyst, and/or a content of the acid-based additive is 0.05 parts by mass or more and 3.2 parts by mass or less relative to 100 parts by mass of the conductive powder including the base metal, and
• (2) the content of the amine-based additive is 0.05 parts by mass or more and 3.2 parts by mass or less relative to 100 parts by mass of the conductive powder including the base metal.