Injection mold and injection molding method
AssigneeHuawei Technologies Co., Ltd.
InventorsFankun Wu, Zhen Lv, Zhaozheng Hou
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AssigneeHuawei Technologies Co., Ltd.
InventorsFankun Wu, Zhen Lv, Zhaozheng Hou
Estimating the term…
An injection mold and an injection molding method are provided. The injection mold includes a housing and a cover. The housing is provided with a mold cavity. The mold cavity is configured to accommodate a power module. The cover is provided with a plurality of vias. The cover is detachably connected to the housing. The cover is located in the mold cavity and locates the power module jointly with the housing. The plurality of vias is configured to match a plurality of pins of the power module. In the present disclosure, the cover is disposed, and the cover is provided with the vias for pins to pass through. By using covers with different arrangement manners of vias, a same set of injection molds can be compatible with power modules of a same series that have different locations of pins. Arrangement manners of vias on different covers are different.
An injection mold, comprising a housing and a cover, wherein
An injection molding method, comprising:
An injection mold, comprising:
Dependencies are inferred from the claim text.