Process tool tending robots

Abstract

Apparatus and methods for process tool tending in a semiconductor fab are disclosed. In certain embodiments, a robot includes a robotic arm and a turntable that rotates relative to the robotic arm. The turntable holds at least one lot box storing a wafer cassette of semiconductor wafers, and the robotic arm includes an end-effector operable to manipulate the lot box. Accordingly, the robot handles wafer lot boxes to improve semiconductor fab throughput by automating unloading and loading processes that are conventionally performed manually. For example, the robot can transport a wafer lot box to a point of use, remove the wafer cassette from the lot box, load the wafer cassette into a tool at the point of use, remove the wafer cassette from the tool after processing, reload the wafer cassette into the lot box, and transport the lot box to the next point of use.

Dependencies are inferred from the claim text.