Substrate processing method and substrate processing apparatus

A substrate processing apparatus for applying a filler to a laminated substrate having a first substrate and a second substrate bonded to each other, comprising:

• a filler application module configured to apply the filler to the laminated substrate;
• and
• an operation controller configured to control an operation of the filler application module,
• wherein the filler application module includes:
• a substrate holder configured to hold the laminated substrate;
• an application device configured to inject the filler into a gap between an edge portion of the first substrate and an edge portion of the second substrate to thereby apply the filler to the gap;
• a curing device configured to cure the applied filler;
• and
• an infrared imaging device configured to emit infrared light to an edge portion of the laminated substrate, receive infrared light reflected from the edge portion of the laminated substrate, and generate an image of the edge portion of the laminated substrate to which the filler is applied, and
• the operation controller is configured to determine a filling state of the filler applied to the gap and cured based on the image.