Package for accommodating electronic component, electronic apparatus, and electronic module

A package for accommodating an electronic component, comprising:

• an insulating substrate including a first surface including a mount portion to receive the electronic component,
• a second surface opposite to the first surface,
• a first side surface connecting the first surface and the second surface,
• a second side surface connecting the first surface and the second surface and continuous with the first side surface, and
• a corner at which the first side surface and the second side surface intersect and extending from the first surface to the second surface;
• an external-connection conductor on the second surface;
• and
• a corner conductor extending from the external-connection conductor toward the corner,
• wherein the corner conductor extends from the external-connection conductor toward the corner at a gradually greater distance to the external-connection conductor and includes exposed portions exposed on the first side surface excluding the corner and on the second side surface excluding the corner, and
• wherein the corner conductor does not extend to the corner such that the corner conductor has no exposed portion on the corner.