Semiconductor device
AssigneeFuji Electric Co., Ltd.
InventorsAkira Hirao, Yoshinari Ikeda, Motohito Hori
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes: an insulated circuit substrate; a semiconductor chip provided on the insulated circuit substrate; a first external connection terminal provided on the insulated circuit substrate; a relay terminal provided on the insulated circuit substrate; a printed circuit board arranged over the semiconductor chip and connected to the first external connection terminal and the relay terminal; and a first snubber circuit provided on the printed circuit board and having one end connected to the first external connection terminal via the printed circuit board and another end connected to the relay terminal via the printed circuit board.
Claims17
A semiconductor device comprising:
- an insulated circuit substrate;
- one or more semiconductor chips provided on the insulated circuit substrate;
- a first external connection terminal provided on the insulated circuit substrate;
- a relay terminal provided on the insulated circuit substrate;
- a printed circuit board arranged over the one or more semiconductor chips and connected to the first external connection terminal and the relay terminal;
- and
- a first snubber circuit provided on the printed circuit board and having one end connected to the first external connection terminal via the printed circuit board and another end connected to the relay terminal via the printed circuit board.
A semiconductor device comprising:
- an insulated circuit substrate;
- a semiconductor chip provided on the insulated circuit substrate;
- a first external connection terminal provided on the insulated circuit substrate;
- a printed circuit board arranged over the semiconductor chip and connected to the first external connection terminal;
- a second external connection terminal provided on the printed circuit board;
- and
- a snubber circuit provided on the printed circuit board and having one end connected to the first external connection terminal via the printed circuit board and another end connected to the second external connection terminal via the printed circuit board.
Dependencies are inferred from the claim text.