Stacked inductors in multi-die stacking
AssigneeAdeia Semiconductor Bonding Technologies Inc.
InventorsGuilian Gao, Gaius Gillman Fountain, Jr., Belgacem Haba, Rajesh Katkar
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Abstract
Microelectronic devices having stacked electromagnetic coils are disclosed. In one example, a microelectronic device can include a first semiconductor element and a second semiconductor element disposed on the first semiconductor element. The microelectronic device can also include an electromagnetic coil. A first portion of the electromagnetic coil and a second portion of the electromagnetic coil may be spaced apart by the first semiconductor element. A first conductive via extending through the first semiconductor element may connect the first and second portions of the electromagnetic coil. Methods for forming such microelectronic devices are also disclosed.
Claims20
A microelectronic device comprising:
- a first semiconductor element having a first substrate;
- a second semiconductor element having a second substrate, the second semiconductor element directly bonded to the first semiconductor element without an intervening adhesive;
- and
- an electromagnetic coil, wherein a first coil portion of the electromagnetic coil and a second coil portion of the electromagnetic coil are spaced apart by at least the first substrate of the first semiconductor element, and wherein a first conductive via extending through the first semiconductor element connects the first and second coil portions of the electromagnetic coil.
A microelectronic device comprising:
- a first semiconductor element having a first substrate;
- a second semiconductor element having a second substrate, the second semiconductor element directly bonded to the first semiconductor element without an intervening adhesive;
- a first electromagnetic coil adjacent to the first substrate of the first semiconductor element, and
- a second electromagnetic coil adjacent to the second substrate of the second semiconductor element,
- wherein the first electromagnetic coil and the second electromagnetic coil are spaced apart by at least the first substrate of the first semiconductor element, and
- wherein at least one of the first electromagnetic coil and the second electromagnetic coil is disposed in a layer configured for direct bonding.
A method of forming a microelectronic device, the method comprising:
- providing a first semiconductor element and a first coiled structure adjacent to the first semiconductor element, a first conductive via extending through the first semiconductor element;
- providing a second semiconductor element and a second coiled structure adjacent to the second semiconductor element;
- and
- directly bonding the second semiconductor element to the first semiconductor element without an intervening adhesive, such that the first coiled structure and the second coiled structure are connected by the first conductive via forming an electromagnetic coil, the first coiled structure and the second coiled structure spaced apart by the first semiconductor element.
Dependencies are inferred from the claim text.