Optical semiconductor device, method for manufacturing same, solid-state imaging device, and electronic device
AssigneeKaneka Corporation
InventorsDaiki Kinoshita, Yuta Saito, Kenta Kuroda
Life of this patent
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Abstract
An optical semiconductor device includes a semiconductor substrate provided with a light receiving element; a transparent substrate facing a surface of the semiconductor substrate on which the light receiving element is provided; and an adhesive layer that bonds the semiconductor substrate and the transparent substrate. The adhesive layer is provided so as to surround the light receiving element. The adhesive layer has a refractive index of 1.60 or less.
Claims17
An optical semiconductor device comprising:
- a semiconductor substrate provided with a light receiving element;
- a transparent substrate facing a surface of the semiconductor substrate on which the light receiving element is provided;
- and
- an adhesive layer that bonds the semiconductor substrate and the transparent substrate, wherein
- the adhesive layer is provided so as to surround the light receiving element,
- the adhesive layer has a refractive index of 1.60 or less, and
- an angle formed by a surface of the transparent substrate on the semiconductor substrate side and an inner wall surface of the adhesive layer is more than 90°.
A method for manufacturing an optical semiconductor device, comprising:
- forming a patterned adhesive layer on a transparent substrate;
- laminating the transparent substrate on which the adhesive layer is formed and a semiconductor substrate provided with a light receiving element in such a manner that a surface of the transparent substrate on which the adhesive layer is formed and a surface of the semiconductor substrate on which the light receiving element is provided face each other;
- and
- curing the adhesive layer to bond the transparent substrate and the semiconductor substrate, wherein
- the adhesive layer is disposed on a periphery of the light receiving element in lamination of the transparent substrate and the semiconductor substrate,
- a refractive index of the cured adhesive layer is 1.60 or less, and
- in formation of the patterned adhesive layer, a film formed of a photosensitive composition is patterned in a semi-cured state by photolithography.
A method for manufacturing an optical semiconductor device, comprising:
- forming a patterned adhesive layer on a transparent substrate;
- laminating the transparent substrate on which the adhesive layer is formed and a semiconductor substrate provided with a light receiving element in such a manner that a surface of the transparent substrate on which the adhesive layer is formed and a surface of the semiconductor substrate on which the light receiving element is provided face each other;
- and
- curing the adhesive layer to bond the transparent substrate and the semiconductor substrate, wherein
- the adhesive layer is disposed on a periphery of the light receiving element in lamination of the transparent substrate and the semiconductor substrate,
- a refractive index of the cured adhesive layer is 1.60 or less, and
- an angle formed by a surface of the transparent substrate on the semiconductor substrate side and an inner wall surface of the adhesive layer is more than 90°.
Dependencies are inferred from the claim text.