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US 12,707,751 B2Granted
Solid-state imaging element, imaging apparatus, and electronic device
AssigneeSony Semiconductor Solutions Corporation
InventorKyosuke Yamada
Life of this patent
Estimating the term…
Abstract
The present disclosure relates to a solid-state imaging element, an imaging apparatus, and an electronic device that can reduce the effects caused by a PAD electrode being formed. When laminating a Logic substrate smaller than an image sensor, a through hole is formed in the image sensor in such a manner as to form a PAD electrode in an embedded member embedded around the logic substrate. The present disclosure can be applied to an imaging apparatus.
Claims20
A solid-state imaging element, comprising:
- a first semiconductor element that has an imaging element for photoelectrically converting incident light;
- and
- a second semiconductor element that is smaller than the first semiconductor element having a signal processing circuit for processing a pixel signal of the imaging element,
- wherein a circumference of the second semiconductor element is embedded with an embedded member, and a PAD electrode is formed in the embedded member.
1 more element
An imaging apparatus, comprising:
- a solid-state imaging element,
- the solid-state imaging element including:
- a first semiconductor element having an imaging element for photoelectrically converting incident light;
- and
- a second semiconductor element smaller than the first semiconductor element having a signal processing circuit for processing a pixel signal of the imaging element,
- a circumference of the second semiconductor element being embedded with an embedded member, and a PAD electrode being formed in the embedded member.
3 more elements
An electronic device, comprising:
- a solid-state imaging element,
- the solid-state imaging element including:
- a first semiconductor element having an imaging element for photoelectrically converting incident light;
- and
- a second semiconductor element smaller than the first semiconductor element having a signal processing circuit for processing a pixel signal of the imaging element,
- a circumference of the second semiconductor element being embedded with an embedded member, and a PAD electrode being formed in the embedded member.
3 more elements
Dependencies are inferred from the claim text.