Systems and methods for EMI shielding

A radar system, comprising:

• a printed circuit board comprising a radar circuit having electro-magnetic radio frequency emissions;
• a metal shield having a top portion and a perimeter connected to the top portion and at least partially surrounding the radar circuit;
• and
• a mask layer having a conductive material and a cavity comprising the metal shield and electrical circuit;
• wherein the perimeter comprises spring elements and gaps, wherein:
• each of the spring elements is integrally formed with a respective portion of the perimeter;
• one or more of the gaps is integrally formed in a respective portion of the perimeter and is disposed between consecutive spring elements comprised among the spring elements;
• and
• each of the spring elements comprise a bent position when contacting a reference circuit of the printed circuit board;
• and
• at least one of the spring elements comprises a first section and a second section,
• wherein, when the metal shield is compressed, one or more of the first section and the second section deflect at a junction between the first section and the second section such that:
• the first section contacts at least the reference circuit, and the second section contacts an inner side surface of the mask layer;
• or
• the first section contacts at least the inner side surface of the mask layer, and the second section contacts at least the reference circuit,
• wherein the inner side surface of the mask layer corresponds to a boundary of the cavity.

A method of forming a shielded electrical circuit comprising steps of:

• providing a printed circuit board having a circuit that generates electromagnetic radio frequency emissions;
• placing a metal shield on the printed circuit board, the metal shield having a top portion and a plurality of side portions connected to the top portion and surrounding the circuit, wherein:
• the plurality of side portions comprise spring elements and gaps;
• each of the spring elements is integrally formed with a respective side portion of the plurality of side portions;
• and
• one or more of the gaps is integrally formed in a respective portion of the plurality of side portions and is disposed between consecutive spring elements comprised among the spring elements;
• wherein placing the metal shield on the printed circuit board comprises steps of compressing the spring elements of the metal shield thereby placing one or more of the spring elements in contact with an electrical reference circuit of the printed circuit board, and wherein compressing the spring elements comprises bending the spring elements;
• and
• securing the metal shield on the printed circuit board by placing the metal shield within a cavity of a conductive mask layer of the printed circuit board,
• wherein the compressing the spring elements comprises compressing each of the spring elements until:
• a first section of the spring element contacts at least the electrical reference circuit, and a second section of the spring element contacts an inner side surface of the conductive mask layer;
• or
• the first section contacts at least the inner side surface of the conductive mask layer, and the second section contacts at least the electrical reference circuit,
• wherein the inner side surface of the conductive mask layer corresponds to a boundary of the cavity.