Headphones
AssigneeShenzhen Shokz Co., Ltd.
InventorsJunjiang Fu, Yueqiang Wang, Chaojie Cui, Lei Zhong, Zhi Cai, Yingying Zhang, Weihua Zhou, Piyou Cheng
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AssigneeShenzhen Shokz Co., Ltd.
InventorsJunjiang Fu, Yueqiang Wang, Chaojie Cui, Lei Zhong, Zhi Cai, Yingying Zhang, Weihua Zhou, Piyou Cheng
Estimating the term…
The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
A headphone, comprising:
Dependencies are inferred from the claim text.