Vertical cavity surface emitting laser, head gimbal assembly, and fabrication process

A process for forming a vertical cavity surface emitting laser (VCSEL) device, comprising:

• etching one or more trenches in a first surface of a substrate, each trench comprising a first surface, a second surface parallel to the first surface, and a third surface perpendicular to the first and second surfaces of the trench, the third surface of the trench connecting the first and second surfaces of the trench;
• forming two laser diode electrodes in the one or more trenches, wherein forming the two laser diode electrodes in the one or more trenches comprises:
• depositing a seed layer comprising a conductive material on the substrate, the seed layer being disposed on the first, second, and third surfaces of each trench;
• patterning a photoresist material on the seed layer, wherein the photoresist material is disposed within at least a portion of each of the one or more trenches;
• and
• depositing a metal containing material on at least a portion of the seed layer that is free of the photoresist material, the metal containing material being disposed over the first, second, and third surfaces of each trench, and over a portion of the first surface of the substrate adjacent to the first and second surfaces of the trench;
• after forming the two laser diode electrodes, cutting the substrate along the one or more trenches to form a VCSEL, the VCSEL comprising:
• a chip for mounting on a slider, the chip having six surfaces, wherein:
• a first surface of the chip is for facing the slider;
• a second surface of the chip is opposite the first surface of the chip;
• and
• the two laser diode electrodes being positioned in any combination on one or more of a third surface of the chip, a fourth surface of the chip, a fifth surface of the chip, or a sixth surface of the chip.

A process for forming a vertical cavity surface emitting laser (VCSEL) device, comprising:

• etching one or more trenches formed therein in a first surface of a substrate, each of the one or more trenches comprising a first surface, a second surface parallel to the first surface of the trench, and a third surface perpendicular to the first and second surfaces of the trench, the third surface connecting the first and second surfaces of the trench;
• depositing a seed layer comprising a conductive material on the substrate, the seed layer being disposed on the first, second, and third surfaces of each of the one or more trenches;
• patterning a photoresist material on the seed layer, wherein the photoresist material is disposed within at least a portion of each of the one or more trenches;
• depositing a metal containing material on at least a portion of the seed layer that is free of the photoresist material, the metal containing material being disposed over the first, second, and third surfaces of each of the one or more trenches, and over a portion of the first surface of the substrate adjacent to the first and second surfaces of the trench;
• removing the photoresist material and a portion of the seed layer from the substrate;
• and
• cutting the substrate along the one or more trenches of the substrate after removing the photoresist material and the portion of the seed layer to form a VCSEL, the VCSEL comprising:
• a chip for mounting on a slider, the chip having six surfaces, wherein:
• a first surface of the chip is for facing the slider;
• a second surface of the chip is opposite the first surface of the chip;
• and
• two laser diode electrodes being positioned in any combination on one or more of a third surface of the chip, a fourth surface of the chip, a fifth surface of the chip, or a sixth surface of the chip, the two laser diode electrodes formed from the seed layer and the metal containing material.