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US 12,706,365 B2Granted
Device for a transition of a high-frequency connection between a strip conductor connection and a waveguide, high-frequency arrangement, and radar system
AssigneeRobert Bosch GmbH
InventorsKlaus Baur, Minh Nhat Pham
Life of this patent
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Abstract
A transition between a strip conductor connection and a waveguide for a high-frequency connection. A strip conductor connection is arranged on a carrier substrate and is adjoined by a transition to a waveguide structure integrated into the carrier substrate. This waveguide structure integrated into the carrier substrate is adjoined by a waveguide on an outer side of the carrier substrate.
Claims7
A high-frequency arrangement, comprising:
- a device for a transition of a high-frequency connection between a strip conductor connection and a waveguide, including:
- an electrically insulating carrier substrate with a top side and a bottom side opposite the top side,
- wherein the carrier substrate includes a first portion with a strip conductor structure, a second portion with a waveguide structure integrated into the carrier substrate, and a third portion with a waveguide arranged on an outer side of the carrier substrate,
- wherein the second portion is arranged between the first portion and the third portion,
- wherein the waveguide structure, integrated into the second portion of the carrier substrate, and the waveguide arranged on the carrier substrate at least partially overlap in an overlap region,
- wherein an aperture is provided in the overlap region in an electrically conductive coating on the top side of the carrier substrate for the waveguide structure integrated into the second portion of the carrier substrate, and
- wherein an electrically conductive connection element is provided on an edge of the aperture and is configured to electrically contact the electrically conductive coating on the top side and an electrically conductive coating on the bottom side of the carrier substrate with one another;
- and
- a monolithic microwave integrated circuit arranged in the first portion on the top side of the carrier substrate.
6 more elements
A device for a transition of a high-frequency connection between a strip conductor connection and a waveguide, comprising:
- an electrically insulating carrier substrate with a top side and a bottom side opposite the top side;
- wherein the carrier substrate includes a first portion with a strip conductor structure, a second portion with a waveguide structure integrated into the carrier substrate, and a third portion with a waveguide arranged on an outer side of the carrier substrate,
- wherein the second portion is arranged between the first portion and the third portion,
- wherein the waveguide structure, integrated into the second portion of the carrier substrate, and the waveguide arranged on the carrier substrate at least partially overlap in an overlap region,
- wherein an aperture is provided in the overlap region in an electrically conductive coating on the top side of the carrier substrate for the waveguide structure integrated into the second portion of the carrier substrate, and
- wherein an electrically conductive connection element is provided on an edge of the aperture and is configured to electrically contact the electrically conductive coating on the top side and an electrically conductive coating on the bottom side of the carrier substrate with one another.
3 more elements
A radar system, comprising:
- a high-frequency arrangement including:
- a device for a transition of a high-frequency connection between a strip conductor connection and a waveguide, including:
- an electrically insulating carrier substrate with a top side and a bottom side opposite the top side,
- wherein the carrier substrate includes a first portion with a strip conductor structure, a second portion with a waveguide structure integrated into the carrier substrate, and a third portion with a waveguide arranged on an outer side of the carrier substrate,
- wherein the second portion is arranged between the first portion and the third portion,
- wherein the waveguide structure, integrated into the second portion of the carrier substrate, and the waveguide arranged on the carrier substrate at least partially overlap in an overlap region,
- wherein an aperture is provided in the overlap region in an electrically conductive coating on the top side of the carrier substrate for the waveguide structure integrated into the second portion of the carrier substrate, and
- wherein an electrically conductive connection element is provided on an edge of the aperture and is configured to electrically contact the electrically conductive coating on the top side and an electrically conductive coating on the bottom side of the carrier substrate with one another;
- and
- a monolithic microwave integrated circuit arranged in the first portion on the top side of the carrier substrate.
7 more elements
Dependencies are inferred from the claim text.