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US 12,706,284 B2Granted
Adhesion removal method and film-forming method
AssigneeResonac Corporation
InventorsYosuke Tanimoto, Shimon Osada
Life of this patent
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Abstract
Provided are an adhesion removal method capable of removing sulfur-containing adhesions that adhere onto the inner surface of a chamber or the inner surface of a pipe connected to the chamber without disassembly of the chamber and a film-forming method. Sulfur-containing adhesions adhering onto at least one of the inner surface of a chamber (10) and the inner surface of a discharge pipe (15) connected to the chamber (10) are removed by reaction with a cleaning gas containing a fluorine-containing compound gas.
Claims5
An adhesion removal method comprising:
- reacting a sulfur-containing adhesion with a cleaning gas to form a sulfur fluoride gas, the sulfur-containing adhesion adhering onto at least one of an inner surface of a chamber and an inner surface of a pipe connected to the chamber, thereby removing the sulfur-containing adhesion,
- wherein the cleaning gas consists of fluorine gas and an inert gas, and
- wherein the cleaning gas is brought into contact with the adhesion in a condition of a temperature of 350° C. to 800° C. and a pressure of 20 Pa to 101 kPa.
Dependencies are inferred from the claim text.