Window of a foldable electronic apparatus and method for manufacturing the same

An electronic apparatus comprising:

• a window module comprising:
• a glass substrate including:
• an upper surface including an upper surface of a recessed portion;
• a lower surface opposed to the upper surface;
• and
• a plurality of side surfaces connecting the upper surface and the lower surface;
• a first film including a surface facing the plurality of side surfaces of the glass substrate;
• a second film spaced apart from the upper surface so that a space is defined between the second film and the upper surface, the second film including:
• a first surface in which a groove portion facing the recessed portion of the upper surface is defined;
• a third film including a second surface facing the lower surface of the glass substrate;
• and
• a resin filled into the space,
• wherein the resin contacts the recessed portion of the upper surface and a portion of the first surface defining the groove portion, and the first film is disposed between the first surface and the second surface.

A method for manufacturing a window, the method comprising:

• providing a glass substrate which includes an upper surface including an upper surface of a recessed portion, a lower surface opposed to the upper surface, and a plurality of side surfaces connecting the upper surface and the lower surface;
• disposing a first film which includes a surface facing the plurality of side surfaces of the glass substrate;
• disposing a second film which is spaced apart from the upper surface so that a predetermined space is defined between the second film and the upper surface, the second film including:
• a first surface in which a groove portion facing the recessed portion of the upper surface is defined,
• disposing a third film which includes a second surface facing the lower surface of the glass substrate so that the first film is disposed between the first surface and the second surface;
• filling, with a resin, a space defined between the glass substrate and the first to third films such that the resin contacts a portion of the first surface defining the groove portion and the recessed portion of the upper surface of the glass substrate;
• and
• curing the resin,
• wherein the resin is filled by a capillary phenomenon.