Substrate treatment method, storage medium, and substrate treatment apparatus
AssigneeTokyo Electron Limited
InventorTakashi Yamauchi
Life of this patent
Estimating the term…
Abstract
A substrate treatment method performs a treatment for forming a pattern of a metal-containing resist on a substrate. The method includes changing an acid concentration in a substrate existence space where the substrate exists in a substrate treatment apparatus before a developing treatment of a film of the metal-containing resist.
Claims15
A substrate treatment method of performing a treatment for forming a pattern of a metal-containing resist on a substrate, the substrate treatment method comprising
- increasing an acid concentration in a substrate existence space where the substrate exists in a substrate treatment apparatus during a period after an exposure treatment on a film of the metal-containing resist and before transferring into a part for performing a post exposure bake treatment.
A substrate treatment apparatus for performing a treatment for forming a pattern of a metal-containing resist on a substrate, the substrate treatment apparatus comprising
- an acid concentration change part configured to increase an acid concentration in a substrate existence space where the substrate exists in the substrate treatment apparatus during a period after an exposure treatment on a film of the metal-containing resist and before transferring into a part for performing a post exposure bake treatment.
A substrate treatment method of performing a treatment for forming a pattern of a metal-containing resist on a substrate, the substrate treatment method comprising
- increasing an acid concentration in a substrate existence space where the substrate exists in a substrate treatment apparatus during a period after transferring out from a part for performing a post exposure bake treatment and before a developing treatment of a film of the metal-containing resist.
A substrate treatment apparatus for performing a treatment for forming a pattern of a metal-containing resist on a substrate, the substrate treatment apparatus comprising
- an acid concentration change part configured to increase an acid concentration in a substrate existence space where the substrate exists in the substrate treatment apparatus during a period after transferring out from a part for performing a post exposure bake treatment and before a developing treatment of a film of the metal-containing resist.
Dependencies are inferred from the claim text.