US 12,704,422 B2Granted

Apparatus and method for force sensing, and electronic device

AssigneeGoertek Inc.

InventorsHirotada Taniuchi, Katsumi Saito

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Abstract

An apparatus and a method for force sensing, and an electronic device. The apparatus includes a sensor and a filter. The sensor is configured to generate a first signal which is determined based on deformation of at least a part of the sensor and temperature of at least the part of the sensor. The part of the sensor is attached to a deformable portion of the electronic device. The filter is configured to receive the first signal, and remove a change from the first signal to acquire a second signal, where the change is due to the temperature of the part of the sensor. In comparison with the first signal, the second signal is less sensitive to the temperature, and therefore can indicate the deformation of the deformable portion more accurately. The electronic device can make an accurate response when the deformable portion deforms.

Claims20

Dependent claims

An apparatus for force sensing, located in an electronic device, wherein the electronic device comprises a deformable portion, and the apparatus comprises:

a sensor, configured to generate a first signal, wherein the first signal comprises a component of higher frequency corresponding to deformation of at least a part of the sensor and a component of lower frequency corresponding to temperature of at least the part of the sensor, and the part of the sensor is attached to the deformable portion;
a flexible layer, attached to the deformable portion;
and
a filter, configured to:
receive the first signal;
and
remove the component of lower frequency from the first signal to acquire a second signal,
wherein the part of the sensor is attached to the deformable portion via at least a part of the flexible layer,
wherein the flexible layer comprises one or both of:
a layer made of a thermal insulating material;
and
a heat spreading layer, in which thermal conductivity along a thickness of the heat spreading layer is smaller than thermal conductivity within a plane perpendicular to the thickness of the heat spreading layer.

9 more elements

A method for force sensing, applied to an electronic device, comprising:

generating a first signal by a sensor, wherein the first signal comprises a component of higher frequency corresponding to deformation of at least a part of the sensor and a component of lower frequency corresponding to temperature of at least the part of the sensor, and the part of the sensor is attached to a deformable portion of the electronic device, a flexible layer being attached to the deformable portion;
receiving the first signal by a filter;
and
removing, by the filter, the component of lower frequency from the first signal to acquire a second signal,
wherein the part of the sensor is attached to the deformable portion via at least a part of the flexible layer,
wherein the flexible layer comprises one or both of:
a layer made of a thermal insulating material;
and
a heat spreading layer, in which thermal conductivity along a thickness of the heat spreading layer is smaller than thermal conductivity within a plane perpendicular to the thickness of the heat spreading layer.

6 more elements

Dependencies are inferred from the claim text.

Facts

Application: 18/264,776Filed 9 Feb 2021
Published: US 2024/0094074 A121 Mar 2024
Granted: 11 Aug 2026
Term ends: Not estimatedThe source records don’t support an estimate.

Classification4 codes

G01L 1/26
Measuring force or stress, in general: auxiliary measures taken, or devices used, in connection with the measurement of force, e.g. for preventing…
G01L 1/2281
Arrangements for correcting or for compensating unwanted effects: for temperature variations
G01L 1/2287
Using resistance strain gauges: constructional details of the strain gauges
G01L
Measuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure