Void fill packaging product and methods for making
AssigneeTemperpack Technologies, Inc.
InventorJames McGoff
Life of this patent
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Abstract
Briefly described, embodiments of the presently disclosed subject matter relate to void fill packaging products and one or more methods for making the void fill packaging products. The void fill packaging product is configured to cushion items for transport whether that be shipping long distances, local delivery, or self-transport in a vehicle. Specifically, in one aspect, a void fill product for packaging, may include a single spiraled continuous paper sheet surrounding a hollow center and forming at least two layers that overlap in a first direction. The portions of the at least two layers may overlap and may be mechanically joined in a second direction that is approximately perpendicular to the first direction.
Claims19
A void fill product for packaging, comprising:
- a single spiraled continuous paper sheet surrounding a hollow center and forming at least two layers that overlap in a first direction,
- wherein portions of the at least two layers overlap and are mechanically joined in a second direction that is approximately perpendicular to the first direction, and
- wherein at least a first layer of the at least two layers surrounds the hollow center at an angle in relation to a longitudinal axis of the void fill product.
A void fill product for packaging, comprising:
- a single spiraled continuous sheet surrounding a hollow center and forming at least two layers that overlap in a first direction,
- wherein portions of the at least two layers overlap and are mechanically joined in a second direction, and
- wherein at least a first layer of the at least two layers surrounds the hollow center at an angle in relation to a longitudinal axis of the void fill product.
Dependencies are inferred from the claim text.