Chip package with embedded and shielded inductors

A chip package comprising:

• an integrated circuit (IC) die having functional circuitry;
• and
• a package substrate coupled with the IC die and comprising:
• a package core comprising vias;
• a plurality of build-up layers disposed on an upper surface of the package core, the plurality of build-up layers comprising metal traces connected with the vias;
• and
• a magnetic core inductor disposed in a cavity of the package core and comprising:
• a magnetic inlay;
• and
• a first metal layer disposed in the cavity on the magnetic inlay below the plurality of build-up layers, wherein the first metal layer is a conductive shielding layer electrically isolated from conductive paths of the magnetic core inductor by a gap between the first metal layer and the conductive paths.

A method of embedding a magnetic core inductor in a package substrate, the method comprising:

• generating a cavity in a core of the package substrate;
• attaching a base substrate to a first side of the core;
• plating a conductive material onto a magnetic inlay;
• forming a conductive path in the magnetic inlay;
• disposing the magnetic inlay inside the cavity;
• binding the core and the magnetic inlay with a dielectric material;
• forming, with the dielectric material, a second binding layer at a second side of the core that is opposite to the first side;
• and
• removing the base substrate.