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AssigneeCommissariat A L'energie Atomique Et Aux Energies Alternatives
InventorsFrank Fournel, Aziliz Calvez, Vincent Larrey, Christophe Morales
Estimating the term…
A direct bonding method between two substrates includes the steps of: providing a first substrate and a second substrate respectively including a first hydrophilic bonding surface and a second hydrophilic bonding surface; depositing on the first and/or on the second hydrophilic bonding surface a basic solution consisting of strong base molecules and deionized water; drying the first and/or the second hydrophilic bonding surface until a concentration with between approximately 109 atom/cm2 and 1015 atom/cm2 of cations resulting from the strong base molecules on the first and/or on the second hydrophilic bonding surface; contacting the first and the second hydrophilic bonding surface so as to obtain a spontaneous direct bonding and an assembly of the first substrate with the second substrate including a direct bonding interface.
A direct bonding method between two substrates, the method comprising the steps of:
An assembly comprising a first substrate and a second substrate made of silicon respectively comprising a first hydrophilic bonding surface and a second hydrophilic bonding surface, the first and the second surface hydrophilic bonding surface being bonded by direct bonding, strong base molecules being arranged with a concentration comprised between approximately 109 atoms/cm2 and 1015 atoms/cm2, at the direct bonding interface between the first and the second hydrophilic bonding surface.
Dependencies are inferred from the claim text.