Semiconductor process device and wafer support structure thereof

A semiconductor process device, comprising:

• a vacuum transfer chamber;
• a front-end chamber;
• and
• a loading chamber;
• wherein the loading chamber is disposed between the vacuum transfer chamber and the front-end chamber, and a wafer support structure disposed in the loading chamber includes:
• a lifting component;
• a supporting component;
• a compressing component;
• and
• an adjusting component;
• wherein:
• the lifting component includes a lifting shaft, a mounting section is provided on a top surface of the lifting shaft;
• a first end of the supporting component is sleeved in a mounting hole of the mounting section;
• an inner peripheral wall of the mounting hole and an outer peripheral wall of the mounting section are separated by an adjustment space, a second end of the supporting component is arranged to extend along a radial direction of the lifting shaft;
• the compressing component is sleeved on an outer periphery of the mounting section and located in the adjustment space;
• and
• the adjusting component is connected with the supporting component, a portion of the adjusting component is located in the adjustment space and is configured to squeeze the compressing component to deform to lock the mounting section and the supporting component;
• the adjusting component is configured to adjust a degree of compression of the compressing component at different positions in a circumferential direction of the mounting hole to adjust levelness and/or a centerline angle of the supporting component.