Light-receiving device, X-ray imaging device, and electronic apparatus

An X-ray imaging device, comprising:

• a first semiconductor substrate having a first surface and a second surface opposed to each other and receiving application of a first potential, the first semiconductor substrate including a plurality of light-receiving elements arranged two-dimensionally in matrix, the plurality of light-receiving elements generating signal charge based on an X-ray;
• a second semiconductor substrate having a third surface and a fourth surface opposed to each other, with the first surface of the first semiconductor substrate and the third surface being disposed to be opposed to each other, the second semiconductor substrate receiving application of a second potential lower than the first potential, and including a logic circuit that processes a light-receiving signal based on electric charge outputted from the plurality of light-receiving elements;
• and
• an interlayer insulating layer provided between the first semiconductor substrate and the second semiconductor substrate, wherein
• the second semiconductor substrate has a side surface recessed more inward than a side surface of the first semiconductor substrate, and
• the side surface of the second semiconductor substrate is coated with a protective film.

An electronic apparatus, comprising:

• an X-ray imaging device including
• a first semiconductor substrate having a first surface and a second surface opposed to each other and receiving application of a first potential, the first semiconductor substrate including a plurality of light-receiving elements arranged two-dimensionally in matrix, the plurality of light-receiving elements generating signal charge based on an X-ray,
• a second semiconductor substrate having a third surface and a fourth surface opposed to each other, with the first surface of the first semiconductor substrate and the third surface being disposed to be opposed to each other, the second semiconductor substrate receiving application of a second potential lower than the first potential, and including a logic circuit that processes a light-receiving signal based on electric charge outputted from the plurality of light-receiving elements, and
• an interlayer insulating layer provided between the first semiconductor substrate and the second semiconductor substrate, wherein
• the second semiconductor substrate has a side surface recessed more inward than a side surface of the first semiconductor substrate, and
• the side surface of the second semiconductor substrate is coated with a protective film.

A light-receiving device, comprising:

• a first semiconductor substrate having a first surface and a second surface opposed to each other and receiving application of a first potential, the first semiconductor substrate including a plurality of light-receiving elements arranged two-dimensionally in matrix;
• a second semiconductor substrate having a third surface and a fourth surface opposed to each other, with the first surface of the first semiconductor substrate and the third surface being disposed to be opposed to each other, the second semiconductor substrate receiving application of a second potential lower than the first potential, and including a logic circuit that processes a light-receiving signal based on electric charge outputted from the plurality of light-receiving elements;
• and
• an interlayer insulating layer provided between the first semiconductor substrate and the second semiconductor substrate, wherein
• the second semiconductor substrate has a side surface recessed more inward than a side surface of the first semiconductor substrate,
• the side surface of the second semiconductor substrate is coated with a protective film, and
• the first semiconductor substrate and the second semiconductor substrate each have a substantially rectangular shape, and have a corner being worked into a curved shape.

A light-receiving device, comprising:

• a first semiconductor substrate having a first surface and a second surface opposed to each other and receiving application of a first potential, the first semiconductor substrate including a plurality of light-receiving elements arranged two-dimensionally in matrix;
• a second semiconductor substrate having a third surface and a fourth surface opposed to each other, with the first surface of the first semiconductor substrate and the third surface being disposed to be opposed to each other, the second semiconductor substrate receiving application of a second potential lower than the first potential, and including a logic circuit that processes a light-receiving signal based on electric charge outputted from the plurality of light-receiving elements;
• and
• an interlayer insulating layer provided between the first semiconductor substrate and the second semiconductor substrate, wherein
• the second semiconductor substrate has a side surface recessed more inward than a side surface of the first semiconductor substrate,
• the side surface of the second semiconductor substrate is coated with a protective film, and
• the interlayer insulating layer includes a metal film to which a predetermined potential is applied in the layer, the metal film protruding more outward than the side surface of the second semiconductor substrate.

A light-receiving device, comprising:

• a first semiconductor substrate having a first surface and a second surface opposed to each other and receiving application of a first potential, the first semiconductor substrate including a light-receiving region in which a plurality of light-receiving elements are arranged two-dimensionally in matrix and a peripheral region provided around the light-receiving region;
• a second semiconductor substrate having a third surface and a fourth surface opposed to each other, with the first surface of the first semiconductor substrate and the third surface being disposed to be opposed to each other, the second semiconductor substrate receiving application of a second potential lower than the first potential, and including a logic circuit that processes a light-receiving signal based on electric charge outputted from the plurality of light-receiving elements;
• a first first electrically-conductive region provided at an interface of the first surface of the first semiconductor substrate for each of the plurality of light-receiving elements and coupled to a first electrode, in the light-receiving region;
• a second first electrically-conductive region each provided around the first first electrically-conductive region provided for each of the plurality of light-receiving elements and coupled to a second electrode, at the interface of the first surface;
• a third first electrically-conductive region each provided around the second first electrically-conductive region provided for each of the plurality of light-receiving elements and being in an electrically floating state, at the interface of the first surface;
• a fourth first electrically-conductive region provided at the interface of the first surface, the fourth first electrically-conductive region extending to a side surface of the first semiconductor substrate and being in an electrically floating state;
• a first second electrically-conductive region provided at an interface of the second surface and having an electrically-conductive type different from the first first electrically-conductive region;
• and
• a plurality of fifth first electrically-conductive regions provided in a ring shape outside the first second electrically-conductive region at the interface of the second surface, the plurality of fifth first electrically-conductive regions being in an electrically floating state.

A light-receiving device, comprising:

• a first semiconductor substrate having a first surface and a second surface opposed to each other and receiving application of a first potential, the first semiconductor substrate including a plurality of light-receiving elements arranged two-dimensionally in matrix;
• a second semiconductor substrate having a third surface and a fourth surface opposed to each other, with the first surface of the first semiconductor substrate and the third surface being disposed to be opposed to each other, the second semiconductor substrate receiving application of a second potential lower than the first potential, the second semiconductor substrate including a logic circuit that processes a light-receiving signal based on electric charge outputted from the plurality of light-receiving elements, and a plurality of sixth first electrically-conductive regions provided in a ring shape at an interface of the third surface near a peripheral edge part and being in an electrically floating state;
• and
• an interlayer insulating layer provided between the first semiconductor substrate and the second semiconductor substrate.