Isolation structures
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsFeng-Ming Chang, Jing-Yi Lin
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsFeng-Ming Chang, Jing-Yi Lin
Estimating the term…
Semiconductor structures and methods are provided. An exemplary method according to the present disclosure includes forming a fin-like structure over a substrate; forming an isolation feature in the substrate and adjacent to the fin-like structure substrate; forming a dummy gate structure across the fin-like structure, where the dummy gate structure comprises a first portion disposed directly over the fin-like structure and a second portion disposed directly over a portion of the isolation feature; forming a mask film to cover the first portion of the dummy gate structure while exposing the second portion of the dummy gate structure; removing the second portion of the dummy gate structure and the portion of the isolation feature thereunder to form a gate isolation trench; forming a gate isolation structure in the gate isolation trench; and replacing the first portion of the dummy gate structure with a gate stack.
A method, comprising:
A method, comprising:
A semiconductor structure, comprising:
Dependencies are inferred from the claim text.