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US 12,701,720 B2Granted
Optical device and method of manufacture
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHsing-Kuo Hsia, Chen-Hua Yu, Jui Lin Chao
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Abstract
Optical devices and methods of manufacture are presented in which an opening is formed within a first semiconductor device and then bonded to other optical devices. A laser die or other fill material may be used to refill the opening. The first semiconductor device is then electrically connected to an optical interposer.
Claims20
A method of manufacturing an optical device, the method comprising:
- forming a first semiconductor device as a part of a first wafer, the first semiconductor device comprising a layer of active devices and an interconnect structure;
- forming a first opening at least partially through the interconnect structure and the layer of active devices of the first semiconductor device;
- embedding a laser die within the first opening such that first conductive contacts of the laser die have surfaces that are coplanar with surfaces of second conductive contacts of the first semiconductor device;
- and
- bonding the first semiconductor device to an optical interposer while the first semiconductor device remains the part of the first wafer.
2 more elements
A method of manufacturing an optical device, the method comprising:
- receiving a first semiconductor device;
- embedding a laser die within the first semiconductor device, wherein the embedding comprises bonding the laser die to an exposed surface of the first semiconductor device;
- and
- simultaneously bonding the first semiconductor device and the laser die to a first optical interposer.
1 more element
A method of manufacturing an optical device, the method comprising:
- embedding a laser die into a first semiconductor device by bonding the laser die to an exposed surface of the first semiconductor device;
- bonding a first optical interposer to the first semiconductor device while the first semiconductor device is part of a wafer;
- separating the first semiconductor device from a remainder of the wafer to form an optical stack;
- bonding the optical stack to an interposer;
- and
- bonding a memory device to the interposer.
3 more elements
Dependencies are inferred from the claim text.