Thermal management system

A system, comprising:

• a solid state heat pump thermally coupled with a component;
• a first thermal management assembly and a second thermal management assembly:
• wherein the second thermal management assembly is thermally coupled with the solid state heat pump, the second thermal management assembly configured to conduct thermal energy between the component and an external environment via the solid state heat pump;
• and
• wherein the first thermal management assembly is thermally coupled with the component, the first thermal management assembly configured to conduct the thermal energy between the component and the external environment,
• wherein the second thermal management assembly is configured to conduct a first portion of the thermal energy between the component and the external environment via the solid state heat pump, the first thermal management assembly configured to conduct a second portion of the thermal energy between the component and the external environment,
• wherein the first portion and the second portion of the thermal energy create convection movement of a working fluid between the first thermal management assembly and the second thermal management assembly, and
• wherein the second thermal management assembly and the first thermal management assembly are partially thermally isolated from each other by an insulative wall.

A system, comprising:

• a solid state heat pump thermally coupled with a component;
• a first thermal management assembly and a second thermal management assembly;
• wherein the second thermal management assembly is thermally coupled with the solid state heat pump, the second thermal management assembly configured to conduct thermal energy between the component and an external environment via the solid state heat pump;
• wherein the first thermal management assembly is thermally coupled with the component, the first thermal management assembly configured to conduct the thermal energy between the component and the external environment;
• wherein the second thermal management assembly is configured to conduct a first portion of the thermal energy between the component and the external environment via the solid state heat pump, the first thermal management assembly configured to conduct a second portion of the thermal energy between the component and the external environment;
• wherein the first portion and the second portion of the thermal energy create convection movement of a working fluid between the first thermal management assembly and the second thermal management assembly;
• wherein the system further comprises a thermal spreader thermally coupled with the component and disposed between the component and the second thermal management assembly, the heat pump disposed between the thermal spreader and the first thermal management assembly;
• and
• wherein the thermal spreader includes a cantilevered beam with the heat pump disposed between the beam and the first thermal management assembly.

A system, comprising:

• a thermal spreader thermally coupled with a component;
• a solid state heat pump thermally coupled with the component via the thermal spreader;
• a first thermal management assembly and a second thermal management assembly;
• wherein the second thermal management assembly is thermally coupled with the solid state heat pump, the second thermal management assembly configured to conduct thermal energy between the component and an external environment via the solid state heat pump;
• and
• wherein the first thermal management assembly is thermally coupled with the thermal spreader, the first thermal management assembly configured to conduct the thermal energy between the component and the external environment via the thermal spreader,
• wherein the second thermal management assembly and the first thermal management assembly are partially thermally isolated from each other by a thermally insulative divider wall such that a first portion of the thermal energy is conducted between the component and the external environment via the second thermal management assembly and the solid state heat pump, and a second portion of the thermal energy is conducted between the component and the external environment via the first thermal management assembly and the thermal spreader, the first portion and the second portion of the thermal energy being at different temperatures to create convection movement of a working fluid between the first thermal management assembly and the second thermal management assembly;
• wherein the solid state heat pump is disposed between the second thermal management assembly and the first thermal management assembly, and the first thermal management assembly is disposed between the solid state heat pump and the component;
• and
• wherein the system further comprises a thermally insulative divider wall disposed between the second thermal management assembly and the first thermal management assembly.