A microwave device for high frequency application, wherein the microwave device comprises a housing that encompasses a space, wherein at least one circuit structure is accommodated in the housing, wherein the at least one circuit structure comprises a substrate and at least one integrated circuit component arranged on the substrate, wherein an electrically conductive flexible band is provided that is attached to the substrate, wherein the electrically conductive flexible band is electrically connected to the at least one integrated circuit component, wherein the housing has an opening through which an inner conductor is fed so as to extend into the space encompassed by the housing, and wherein the inner conductor is electrically connected to the electrically conductive flexible band in a non-destructive detachable manner.