Sandwich structure power supply module

A power supply module, comprising:

• an inductor pack having a magnetic core, a first winding and a second winding;
• a top PCB (Printed Circuit Board) on top of the inductor pack;
• a first power device chip and a second power device chip on top of the top PCB, wherein each of the first power device chip and the second power device chip has a first pin, a second pin and a third pin, the first pin of the first power device chip is electrically connected to the first winding via the top PCB, the first pin of the second power device chip is electrically connected to the second winding via the top PCB;
• a first metal layer electrically connected to the second pin of the first power device chip, wherein the first metal layer at least partially covers a first side surface of the magnetic core, and wherein the first side surface is perpendicular to the top PCB;
• a second metal layer electrically connected to the second pin of the second power device chip, wherein the second metal layer at least partially covers a second side surface of the magnetic core, and the second side surface is parallel to the first side surface;
• and
• a third metal layer electrically connected to the third pin of the first power device chip and the third pin of the second power device chip, wherein the third metal layer at least partially covers a third side surface of the magnetic core, and the third side surface is perpendicular to the first side surface and the top PCB;
• wherein
• each of the first winding and the second winding has a first end and a second end, and wherein at least one of the first end and the second end is bent to and extended at a plane perpendicular to an axis along a length of the winding.